Wafer pick-and-place equipment is a high-precision automated system designed for semiconductor manufacturing, specializing in separating microchips from wafers and accurately mounting them onto substrates or packaging carriers. Its core requirements include micron-level precision, stability, and protection capabilities for fragile wafers. Based on the documented equipment parameters, we recommend the following solutions:
Solution 1: HW-F5 High-Precision Placer (Basic-Level Wafer Applications)
Core Advantages
- Precision: ±0.035mm (XYZ axes), supports 0201 (0.6×0.3mm) micro components
- Vision System: Flying camera (12×12mm recognition range) + fixed camera (40×40mm) + 6MP Mark camera
- Special Features: Laser PCB warpage compensation, real-time vacuum monitoring, intelligent path optimization (AI algorithm)
- Compatibility: Supports 8-88mm width electric feeders with optional tube/tray feeding
Ideal Applications
- Small-to-medium scale wafer mounting (e.g., sensor chips, MEMS devices)
- R&D or pilot production environments requiring flexible handling of multiple chip sizes
Solution 2: HW-S6 PCB Placer (Advanced Wafer Precision Requirements)
Key Upgrades
- Enhanced Precision: 6MP Mark camera + 5MP flying camera with dual lighting for recognition stability
- Structural Optimization: Enclosed stepper motor eliminates vertical clearance, 31mm nozzle stroke accommodates 14mm tall components
- Stability: Triple-rail screw structure reduces wear, X-axis parallel rail design improves smoothness
- Feeding System: 70 feeder stations (dual front/rear fixed plates) supporting synchronous pickup from 8mm feeders
Ideal Applications
- Large wafer (8-12 inch) continuous production
- High-density chip array mounting (e.g., processors, memory chips)
Solution 3: HW-S5 Dual-Arm Wafer Pick-and-Place Machine (High-Volume Production Solution)
Core Advantages
- Dual-Station Mode: Independent/alternate placement with peak capacity of 84,000 CPH
- Compatibility: Dual tracks support 510×410mm substrates, expandable to 1200mm length
- Smart Control: MES system integration, supports hot-swappable trays and automatic nozzle change (40 nozzle types)
Ideal Applications
- Hybrid wafer-PCB production lines (e.g., simultaneous LED chip + driver board placement)
- High-throughput power device mounting (e.g., IGBT modules)
Selection Recommendations
- Precision Priority: HW-S6’s 6MP vision system is ideal for compound wafers (GaN/SiC) requiring <0.03mm error tolerance
- Mass Production: HW-S5 dual-arm configuration reduces cycle time, perfect for automotive electronics and other high-volume applications
- Cost Control: HW-F5 maintains ±0.035mm precision while consuming only 5KW, suitable for budget-conscious initial investments
Note: All solutions require an anti-static work environment and Z-axis parameter adjustments based on wafer thickness (0.5-9.0mm). We recommend adding PCB warpage detection modules for ultra-thin wafers (<0.2mm) requiring deformation compensation.