Dual-axis copper polishing machine

Main Purpose

This equipment is mainly used for precision grinding of semiconductor materials such as sapphire, silicon wafers, ceramics, lithium tantalate, and gallium arsenide.

1. The entire machine adopts a PLC + touch screen control system, making equipment parameter setting and operation simple and convenient, while ensuring high system stability.
2. The main motor uses variable frequency speed control, achieving soft start and soft stop of the main unit, reducing operational impact and minimizing workpiece damage.
3. The workpiece grinding adopts a cylinder pressure method, with pressure controlled in a closed-loop manner via an electrical proportional valve, ensuring extremely high pressure accuracy and stability.
4. The upper pressure plate adopts an active drive method to ensure uniformity in grinding processing at each station while maintaining the product grinding rate.
5. Both the grinding disk and the upper pressure plate are equipped with a cooling water system, which maximizes the efficiency of the grinding fluid while minimizing distortion of the grinding disk surface.
6. The equipment comes with a disk surface trimming machine, ensuring disk flatness within 0.003mm after trimming.

Main Technical Parameters