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Automatic eutectic mounter

The Automatic Eutectic Mounter is a sophisticated device for precisely attaching semiconductor chips to substrates. It employs advanced eutectic bonding technology, ensuring high reliability and efficiency. Key features include precision placement, user-friendly touch screen controls, versatile bonding methods, high throughput, real-time monitoring, and a compact design for seamless integration into manufacturing lines.

Automatic eutectic mounter

Product Introduction

  • Uses graphical operation programming to effectively improve programming efficiency and reduce personnel requirements.
  • Realizes universal nozzle soft contact to effectively solve the damage problem of air bridges on GaAs chip surfaces.
  • Modular design concept allows independent operation with shared parameters, coordinates, and recognition height.

Product Advantages

  • XYZ Axis: Travel 200mm*320mm*50mm, compatible with carrier size 200mm*170mm.
  • Optional rail transmission system.
  • Overall positioning accuracy: ±3um@3S, ±0.1°@3S (standard board test).
  • UPH: 1000-1500 (with camera calibration), 2000-2500 (without camera calibration).
  • Pressure: 10~1500 g with 0.1g resolution and real-time full closure control.
  • Chip Dimensions: Length*Width: 0.17 mm-25mm, Thickness: 50um-17mm.
  • Optical System: Main camera view field 4.2mm*3.5mm, Auxiliary camera view field 4.2mm*3.5mm.
  • Nozzles: 12 nozzles supporting automatic replacement and online auto-calibration, nozzle length range of 5-20mm.
  • Material System: Supports 24 gel boxes/waffle boxes, optional rail or workbench mode.

Advantages

  • Applicability:
    • Supports receiving remote commands for automatic program retrieval and switching.
    • Supports open SMEMA interface and TCP/IP protocol communication.
    • Main light + 7 ring lights for effective automatic identification and positioning of different substrates.
  • Stability: Linear motor platform for speed and stability; real-time data logging for traceability.
  • Precision: Overall positioning accuracy ±3um@3S; multi-point positioning to address housing deformation.
  • Usability: Local language interface for WYSIWYG; graphical operation for convenience; standardized programming for quick onboarding.

Factory Requirements

  • Dimensions of the standalone automatic pick-and-place machine: 84012202000mm (excluding connection devices)
  • Weight: 800KG
  • Power Supply: AC220V±10%, 50-60HZ, 10A
  • Compressed Air: >=0.2 MPa, flow rate >5LPM, purified air source
  • Vacuum Pipeline Pressure: <-85Kpa, extraction speed >50LPM

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