Product Details

 Home / Product Center / Temporary Bonder Machine

Send an inquiry
Temporary bonding equipment

Temporary Bonder Machine

Dual-arm combined placement enables the fastest placement speed of 84,000 CPH (under our optimal conditions).

The dual-arm dual-drive system effectively ensures precision and consistency during high-speed operation.

Send an Equiry

2”~8” Temporary Bonder Machine

Temporary Bonder Machine 2

Semi-auto bonding machine

Temporary bonding equipment

Auto bonding machine

  • Substrate Size : 2’’~8’’
  • Bonding Material : Wax, Glue
  • Bonding Temperature : ≤ 350°C
  • Bonding Force : ≤ 400N
  • Center Align : ≤0.1mm(Auto) ≤0.5mm(Semi-Auto)
  • After Bonding TTV : ≤ 3.0um
  • Application : Si, GaN, GaAs, SiC

8”~12” Temporary Bonder Machine

Temporary bonding equipment

Semi-auto bonding machine

Temporary bonding equipment

Auto bonding machine

  • Bonding Material : Glue
  • Bonding Material : Wax, Glue
  • Bonding Temperature : ≤ 350°C
  • Bonding Force : ≤ 60kN
  • Center Align : ≤50um
  • After Bonding TTV : ≤ 4.0um
  • WPH : ≥ 8
  • Application : Fan-Out, 2.5D/3D

2”~8” Thermal De-Bonder

Temporary Bonder Machine 2

Semi-auto bonding machine

2”~8” Thermal De-Bonder

Auto bonding machine

  • Substrate Size : 2’’~8’’
  • De-Bonding Material : Wax, Glue
  • De-Bonding Temperature : ≤ 350°C
  • Wafer Thickness : 30um~1000um
  • Application : Si, GaN, GaAs, SiC

8”~12” Laser De-Bonder

Temporary bonding equipment
Laser Debonding Equipment

Semi-auto

8’’~12’’ Permanent Bond and Align system

Temporary bonding equipment

Bonding Chamber

Temporary bonding equipment

Alignment System

  • Substrate Size : 8’’~12’’
  • Bonding Material : Si-Si, Si-Glass, Metal-Metal
  • Bonding Temperature : ≤ 550°C
  • Bonding Force : ≤ 60kN
  • Alignment Accuracy : ≤±2.0um
  • Application : Fusion Bond, Anodic Bond, Plasma Activation Bond

Permanent Bond and Align system

Table of Contents

Categories

  1. Auto Insertion Machine
  2. SMT Feeder Machine​
  3. SMT Peripheral Equipment
  4. PCBA and PCB Cleaning Machine
  5. PCB Separator Machine
  6. Wire Bonding and Die Bonder
  7. PCB Board Handing System
  8. lon Beam Equipment
  9. ESD Anti-static Product

Recent Post

Permanent Bond and Align system

  1. Load Port
  2. Transfer Robot
  3. Pre-Aligner
  4. Plasma Chamber
  5. RCA Cleaner
  6. Aligner
  7. Bond Chamber

Process Flow

RCA Clean → Plasma Treatment → Alignment → Bonding → Anneal

How to Choose Equipment

Temporary bonding equipment

Get Your Quote

What delivery did you have in mind? Fill in the details below to receive a quote.
Whatsapp
Envelope

SMT Machine One-stop Solution

Products
Quick Links
Get In Touch

Rm3A08 (4th Floor) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China

© 2025 All Rights Reserved.