This HW582 LED high-speed wire bonder is mainly designed for small BTO end LED products, with a cycle time of 40ms/wire. Applicable to variable wire materials: gold/alloy/copper wire. Taking fine wire bonding to new levels of productivity and efficiency. Fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles.
Capability | Cycle time | 40ms/wire |
Bonding accuracy | ±2μm | |
Wire diameter | Φ15μm-Φ50μm | |
XY Table | Drive Mechanism | Linear motor driven |
XY Resolution | 50nm | |
Bonding area | X:56mm, Y:75mm | |
PR system | 1/3″ CMOS camera | |
Material Handling system | Handling Mechanism | Vertical stack |
No. of magazines | 2-3 | |
Applicable magazine | Length | 100-275mm |
Width | 22-78mm | |
Thickness | 0.07-2.0mm |
Rm3A08 (4th Floor) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China
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