Auto Epoxy Die Bonder

Product Introduction

• Uses graphical operation programming to effectively improve programming efficiency and reduce personnel requirements.
• Realizes universal nozzle soft contact to effectively solve the damage problem of air bridges on GaAs chip surfaces.
• Modular design concept allows independent operation with shared parameters, coordinates, and recognition height.

Product Advantages

• XYZ Axis: Travel 200mm*320mm*50mm, compatible with carrier size 200mm*170mm.
• Optional rail transmission system.
• Overall positioning accuracy: ±3um@3S, ±0.1°@3S (standard board test).
• UPH: 1000-1500 (with camera calibration), 2000-2500 (without camera calibration).
• Pressure: 10~1500 g with 0.1g resolution and real-time full closure control.
• Chip Dimensions: Length*Width: 0.17 mm-25mm, Thickness: 50um-17mm.
• Optical System: Main camera view field 4.2mm*3.5mm, Auxiliary camera view field 4.2mm*3.5mm.
• Nozzles: 12 nozzles supporting automatic replacement and online auto-calibration, nozzle length range of 5-20mm.
• Material System: Supports 24 gel boxes/waffle boxes, optional rail or workbench mode.

Advantages

• Applicability:
  • Supports receiving remote commands for automatic program retrieval and switching.
  • Supports open SMEMA interface and TCP/IP protocol communication.
  • Main light + 7 ring lights for effective automatic identification and positioning of different substrates.
• Stability: Linear motor platform for speed and stability; real-time data logging for traceability.
• Precision: Overall positioning accuracy ±3um@3S; multi-point positioning to address housing deformation.
• Usability: Local language interface for WYSIWYG; graphical operation for convenience; standardized programming for quick onboarding.

Factory Requirements

• Dimensions of the standalone automatic pick-and-place machine: 84012202000mm (excluding connection devices)
• Weight: 800KG
• Power Supply: AC220V±10%, 50-60HZ, 10A
• Compressed Air: >=0.2 MPa, flow rate >5LPM, purified air source
• Vacuum Pipeline Pressure: <-85Kpa, extraction speed >50LPM