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  1. Automatische Einsteckmaschine
  2. SMT Feeder Maschine
  3. SMT-Peripheriegeräte
  4. PCBA und PCB Reinigungsmaschine
  5. PCB-Trennmaschine
  6. Drahtbonden und Die Bonder
  7. PCB Board Handing System
  8. lon Beam Ausrüstung
  9. ESD Antistatisches Produkt

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Bleifrei-Stickstoff-Reflow-Spritzgießmaschine

Lead-free Wave Soldering Machine

This series lead-free wave solder machine includes titanium fingers conveyor resistant to high temperatures, can handle all high-volume manufacturing requirements. Backed by our 2 years warranty and high quality after sales service. It's the safe choice for customer requiring no compromise quality, reliability, and exceptional value for cost.
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Lead-free Wave Soldering Machine HWU-350/450

Beschreibung

We have a full range of wave solder machine, nitrogen is an option, please contact us to discuss your individual requirement.

Eigenschaften
  • The guide rail can bear up to 80kg, new heavy finger, anti-shaking, ball chain structure.
  • Low dross oxidization, new wave nozzle design, the pot has automatic in, out, lifting function.
  • Selective area spray, flux can save up to 70%.
  • Free combination of hot air and infrared preheating module.
  • Segmented transportation rail design, 80kg rail transportation capacity, the maximum width of PCB can be increased to 610mm.
  • With advance temperature controller, counter, timer, and speed controller etc., provide a stable performance of the machine.
  • Solder pot we provide titanium and cast iron for option.
  • Light and sound alarm for overheating and emergency stop.
  • The conveyor system is equipped with overload protection.
Technische Parameter
Lead-free Wave Soldering Machine HWU-350/450

Modell

HWU-350

HWU-450

Parameter der Maschine

Dimension (L x W x H)mm

4500x1500x1800mm

Energieversorgung

3 phase, 380V 50/60HZ

General power

25KW

Leistung beim Start

15KW

Normaler Stromverbrauch

Approx.3-8KW

Preheat system parameters

Preheat mode

Hot air

Speed control

stepless frequency

Preheat zone No.

4

Preheat length

1800mm

Preheat temp

Room temp – 250℃

Soldering system

Solder pot-driven mode

Mechanical pump

Solder pot material

titanium

Heater power

Case iron:14.5KW; titanium:12KW

Case iron: 14.5KW; titanium:15KW

Pot volume

500-550kg

Temp control mode

PID + SSR

Warm-up time

About 90Min (set 250℃)

Fördersystem

PCB width

50-350mm

50-450mm

Component height

top:120mm, bottom:25±5mm

Geschwindigkeit des Förderbandes

0-1800mm.min

Höhe des Förderbandes

750±20mm (option: 900±20mm)

Conveyor type

Titanium finger

Solder angle

3-7°

PCB direction

L to R or R to L

Conveyor motor power

120V 3P 220VAC

N2 system (option)

Nitrogen consumption

15m3/h, <1000PPM

Nitrogen supply

0.5-0.8Kpa

Andere

Flux auto feeding

Ja

Flux flow

20-100ml/min

Spray pressure

0.25-0.4MPa

Cooling (option)

2HP 2P 220VAC

Center support

Option

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Rm3A08 (4. Stock) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China

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