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Die Bonder for LED

Die bonding is the process of fixing the wafer chip on the substrate or package.

LED Die Bonder HWS100-N

This HWS100-N high precision die bonder is a high accuracy system for LED products, suitable for SMD020, 1010, 2121, 2835, lamp filament, and COB etc. The tool features automated handling of chips and substrates. The cycle time is up to 65ms.

High-precision die bonder machine and process control technology ensure the quality and efficiency.

Adoption of high-precision dual bonding head, dual dispensing, and dual wafer searching systems.
Adopt linear motor drive the wafer searching platform(X/Y) and feeding platform(B/C).
Adopt automatic loading and unloading system to minimize changeover time.
Adopt direct drive motor to drive the bonding head.
Adopt programmable constant temperature dispensing system.
High precision dispensing group, with glue drawing function.
With detection function before and after double dispensing.
With the function of glue spot size and position automatic compensation.
With both dipping and dispensing glue system.
With vacuum leakage detection function.
High efficiency and productivity.
The industrial computer controls the operation of the equipment, simplifying the operation of automated equipment

Modell	HWS100-N
Production Cycle time	65ms (depends on the chip sizes and holder)
X/Y Accuracy	±1mil (±0.025mm)
Rotation	±3° (option)
Chip dimension	3x3mil – 800x80mil
Max angle correction	±15°
Max wafer size	6″ (152mm) outside diameter
Resolution	1μm(0.04mil)
Thimble Z stroke	2mm
Bonding system	Swing arm-and-hand system
Image recognition gray scale	256 level grey
Image resolution	720×540 pixels
Chip absorbing pressure	30-250g
Fixture length	110-300mm
Fixture width	50-100mm
Energieversorgung	AC220V 50HZ
Rated power	Approx. 1.6KW
Air consumption	40L/min
Luftzufuhr	0.5Mpa

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Rm3A08 (4. Stock) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China