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Inhaltsverzeichnis

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  1. Automatische Einsteckmaschine
  2. SMT Feeder Maschine
  3. SMT-Peripheriegeräte
  4. PCBA und PCB Reinigungsmaschine
  5. PCB-Trennmaschine
  6. Drahtbonden und Die Bonder
  7. PCB Board Handing System
  8. lon Beam Ausrüstung
  9. ESD Antistatisches Produkt

Neuester Beitrag

Wire Bonder for IC

Wire Bonder for IC

Wire bonding machine is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding is generally considered the most cost-effective and flexible interconnect technology.
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High Speed Wire Bonder HW585 for IC

Beschreibung

This HW585 IC high-speed wire bonder is mainly for integrated circuit (IC) products, including SOT, SOP, SSOP, TSSOP, DFN, QFN, QFP, BGA, COB, Optocoupler, etc. with a cycle time of 40ms/wire and high accuracy. Applicable to variable wire materials: gold/silver/alloy/copper wire.

Eigenschaften
  • With high UPH, supports frame up to 100mm in width, increasing efficiency and productivity.
  • This is a high-performance model for IC products, bringing high speed and precision in all aspects.
  • Equipped with dual-frequency ultrasonic transducer, high and low frequency flexible switching, greatly improving product adaptability.
  • Piezoelectric ceramic lightweight clamps, increased speed, without the need to the switching for various wire diameters.
  • Fully automatic temperature adaptive system for improved welding precision.
  • Fully intelligent, high-sensitivity BSD system for increased convenience.
  • Self-developed HMC motion control system to improve the accuracy and stability of force output. (New ultra-high speed XY motion platform, fast, stable and air-saving)
Technische Parameter

Capability

Zykluszeit

40ms/wire

Bonding accuracy

±2μm

Wire diameter

Φ15μm-Φ50μm

XY Table

Drive Mechanism

Linear motor driven

XY Resolution

50nm

Bonding area

X:56mm, Y:90mm

PR system

Single optical path (optional dual optical path / programmable autofocus)

Material Handling system

Handling Mechanism

Vertical stack

No. of magazines

2-3

Applicable magazine

Length

95-300mm

Width

28-100mm

Thickness

0.07-2.0mm
(≥1.0mm can be customized)

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