It uses 3D imaging to scan the surface area, and the scanned image is compared to the specified measurements for the specific board. This method is very accurate for detecting defects, which is important because any defect can lead to the board not working or failing early.
This 3D solder paste inspection ensures that PCBs are made correctly by detecting the solder paste.
Modelo | Icon | Icon-D | |
Sistema de imágenes | Cámara | 5MP/12MP industrial camara | |
Resolución | 5MP: 15μm, 20μm; 12MP: 5.5μm, 10μm, 12μm, 15μm | ||
Height Resolution | 0.37μm | ||
iluminación | 3 color ring shape LED (RGB) | ||
Método de medición de la altura | projectors | ||
Estructura del movimiento | Movimiento X/Y | AC Servo | |
Plataforma | Granito | ||
Ajuste de la anchura | Automático | ||
Tipo de transporte | Cinturón | ||
Dirección de carga de la placa | L a R o R a L | ||
Carril fijo | Single lane: 1st fixed rail; Dual-lane: 1st & 3rd or 1st & 4th fixed rail | ||
Configuración del hardware | Sistema operativo | Win10 | |
Comunicación | Ethernet, SMEMA | ||
Potencia | Monofásico 220V, 50/60Hz, 5A | ||
Necesidades de aire | 0,4-0,6Mpa | ||
Altura de la cinta | 900±20mm | ||
Tamaño total | 1000mm*1360*1620mm | ||
Peso del equipo | 950kg | 1000kg | |
Board handling | Tamaño PCB | 50*50-510*610mm | Single lane:50*50-510*320mm |
Max pad height | 600μm | ||
Min pad spacing | 100μm (within height of 150μm) | ||
Max solder paster size | 20*20mm | ||
Min solder paster size | 0.1mm | ||
Borde de sujeción | 3 mm | ||
GR&R | ≤10% | ||
Inspection function | Defects | Icicle, insufficient solder, excess solder, average height, offset, solder bridge, odd shape, exposed copper, golden finger, etc. | |
Inspection speed | 400-450ms/FOV | ||
Solución integral para máquinas SMT
Rm3A08 (4th Floor) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China
2025 Todos los derechos reservados.