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Eutectic die attach machine HW-15D

The eutectic die attach machine is a specialized device used in the semiconductor packaging process to precisely bond chips to substrates. Its operation is based on the melting and solidification of eutectic alloys, typically utilizing gold or aluminum eutectic for the adhesion material.This type of machinery is especially important in the electronic packaging industry, as it provides reliable bonding under high-temperature and high-pressure conditions, ensuring effective thermal and electrical connections between the chip and the substrate. Eutectic die attach machines typically feature precise temperature and pressure control systems, enabling fully automated or semi-automated operations with high repeatability and accuracy, thus improving production efficiency and yield.

Eutectic die attach machine HW-15D

Application area: Optical communication, LiDAR, RF, microwave, infrared, commercial laser, military industry, aerospace.

Machine Advantage

  • Powerful Process Capability: The machine supports multiple processes, including eutectic bonding, adhesive dipping, dispensing, UV curing, and more.

  • Multiple Loading and Unloading Methods: It accommodates various loading options such as blue film, gel pack/waffle pack, and track loading, while also supporting wafer map functionality.

  • Multi-Chip Application: Supports up to 100 different types of nozzles for fully automatic replacement, enhancing versatility for multi-chip applications.

  • Highly Flexible Software: The programmable software system allows for flexible application and supports different products and various process applications with free switching capabilities.

  • Options Available: Includes an automatic loading and unloading system and an assembly line material transfer system for increased efficiency.

ModelHW-15D
Placement ProcessEutectic, adhesive dipping (Ag paste)
Equipment ApplicationCOC/COS; AOC/COB; Gold-Box; RF
Efficiency15-30s/pcs (eutectic), 7-10s/pcs (dipping glue)
Precision±3 μm
Placement SystemX/Y/Z stroke350mmx500mmx50mm
 Axis of Rotation360°, repeated position accuracy: ±0.2°
 Minimum Suction Size0.15*0.2mm
 NozzleAutomatic nozzle replacement. One nozzle holder supports 13 nozzles.
 Pressure10-2000g (Pressure real-time closed-loop feedback) Accuracy: ±10%, 10 ± 1g
Eutectic SystemEutectic platform1
 Heating modePulse heating
 Temperature range25-400°C (option: max 600°C)
 Temperature rise rateMax 50°C/S, adjustable, accuracy: ±3°C
Bonding ProcessNitrogen protection; real-time display of temperature curve
Feeding systemWaffle Pack Gel-PakStandard: 2×2″ / 4×4″ Qty can be customized by customer’s need.
Vision SystemTwo downward-looking cameras and one high-magnification upward-looking camera. Each camera is equipped with programmable 4-way lights (collimated white light, ring RGB tri-color light)
Power supply200-240V 50HZ single-phase 20A
Weight2000kg
Compressed air0.6Mpa 300L/min
Nitrogen0.3Mpa 30L/min 99.9%
Vacuum-80kpa 120L/min
Environment temperature23 ±2°C

One of the machine module layouts, it can be adjusted as customer’s needs.
Eutectic die attach machine HW-15D

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