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Machine de nettoyage de semi-emballages

HW-660 chip package online cleaning machine is mainly used for CSP, WLP, PLP, SIP, FC, and other semiconductor packaging process online cleaning flux residuals, solder balls and particles on semiconductor package products, such as rosin flux, water-soluble flux, non-clean flux, solder paste and other organic and inorganic contaminations.

SMT Semiconductor-package Cleaning Machine

The equipment adopts PC control, mesh belt conveyor system, upper and lower spray cleaning and rinsing mode, is a new type, high precision, online cleaning system.

  • SUS304 stainless steel equipment has high rigidity, temperature resistance, acid and alkali corrosion resistance, and no leakage potential.
  • High-volume encapsulated chip online cleaning system: spray cleaning, rinsing method, efficient removal of flux and other organic and inorganic pollutants.
  • Long chemical cleaning section + multi-stage DI water rinsing + long hot air-drying section.
  • It feed the cleaning liquid and DI water automatically. Adjustable cleaning, rinsing, chemical isolation, air shear pressure.
  • With a significant flow rate and high-pressure cleaning achieves the super cleaning effect.
  • Equipped with rinsing DI water resistivity monitoring system, PC control system, and optional SECS/GEM semiconductor software system.
  • Cleaning liquid concentration detection, automatic compensation, and other optional functions.

Modèle

HW-660

Mesh belt conveyor

600mm

Vitesse du convoyeur à bande en treillis

100-150cm/min

Mesh belt conveyor height

900±50mm

Sens du transfert

De gauche à droite

Max washing height

50mm

Cleaning tank/rinsing water tank volume

320L/140L

Filter precision

1um

Consommation d'eau DI

400-1000L/H

Air exhaust volume

42m3 /h

Système de contrôle

PC + PLC

Alimentation électrique

380VAC, 3P, 50HZ, 132KW

Alimentation en air

0.5Mpa, 200L/min

Plage de résistivité

0-18MΩ

Dimensions de la machine (L*L*H)

7000*1750*1850mm

Poids

3600KG

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