Automatic paste mixer for preparing solder paste for application to printed circuit board pads with dual rotation technology. Solder cream is placed by 45 degrees and rotates along axis direction and solder cream won’t stick to the pot cover.
Mixing principle is based on Motor rotation and revolution mode of agitation, no need to defrost the paste. Need to recovery the paste in short time, then the solder can be used after stirring well and deforming.
Модель | SPM500 |
Dimension(LWH) | 400x400x420mm |
Deaeration time | 1-99 mins |
Revolution speed | 1000RPM |
Rotation speed | 500RPM |
Mixing angle | 45º oblique |
Электропитание | AC 220V 50HZ 60HZ |
Mixing method | Centrifugal mixing |
Mixing capacity | Two jars of 500g paste solder cream in one time. |
Net wight | Approx. 35KG |
Rm3A08 (4 этаж) Блок D, Технологический парк Хуашэнтай, №36 Хангконг Роуд, район Баоань, город Шэньчжэнь, Китай
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