Model | Cube | Cube-D | Cube-XL | |
Image System | Camera | 12MP industrial camara | ||
Resolution | 15μm | 12μm | 10μm | |
FOV | 60*45mm (12MP, 15μm) | |||
lighting | 4 color ring shape LED | |||
Height measurement method | 4-way projectors | |||
Movement structure | X/Y movement | AC Servo (dual drive) | ||
Platform | Granite | |||
Width adjustment | Automatic | |||
Transport type | Belt | |||
Board loading direction | L to R or R to L | |||
Fixed rail | Single lane: 1st fixed rail; Dual Lane: 1st & 3rd or 1st & 4th fixed rail | |||
Hardware configuration | Operating system | Win10 | ||
Communication | Ethernet, SMEMA | |||
Power | Single phase 220V, 50/60Hz, 5A | |||
Air requirement | 0.4-0.6Mpa | |||
Conveyor height | 900±20mm | |||
Overall size | 1140mm*1360*1620mm | 1310*1360*1620mm | ||
Equipment weight | 1100kg | 1150kg | 1300kg | |
PCB size | Size | 50*60-510*510mm | Single lane:50*60-510*560mm | 50*80-650*610mm |
Thickness | ≤6.0mm | |||
Warping | ±3mm | |||
Component clearance | Top clearance 25-50mm adjustable, bottom clearance 45mm | |||
Clamping edge | 3mm | |||
PCB weight | ≤3kg | |||
Inspection categories | Component | Wrong component, missing, polarity, shift, reverse, damage, IC lead ben, IC lifted lead, foreign material, float, coplanarity, tombstone, etc. | ||
Solder joint | No solder, insufficient solder, open solder, excess solder, solder bridge, solder ball, etc. | |||
Component size | Chip:03015 and above,: LSI: 0.3mm pitch and above; others: odd shape component | |||
Measurable range | 35mm(15μm) | |||
Height resolution | 0.3715μm | |||
inspection speed | 450ms/FOV |
Rm3A08 (4th Floor) Block D, Huashengtai Technology Park, No.36 Hangkong Road, Baoan District, Shenzhen City, China
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