The Vertical Thinning Machine is designed for high-speed processing of hard and brittle materials like sapphire and ceramics. Featuring a vertical structure and a wafer self-selection grinding principle, it offers customized product carriers and a fully closed-loop control system for precise grinding. Constructed from high-quality materials, this machine ensures durable performance with excellent accuracy, making it ideal for advanced manufacturing applications.
Mainly used for high-speed thinning of hard and brittle materials, including sapphire, semiconductors, ceramics, quartz crystals, and encapsulated resin circuit boards.
The equipment features a vertical processing structure, employing a wafer self-selection grinding principle.
The product carrier tray is customized according to customer product requirements.
The grinding wheel feed axis adopts a fully closed-loop position control system.
Main Structural Introduction of the Equipment:
The equipment frame, Z-axis column, and spindle motor base are made of high-quality cast iron.
Both the suction cup motor and grinding wheel motor utilize permanent magnet synchronous electric spindles.
The equipment casing employs a sheet metal spraying process, while parts in contact with water (or grinding fluid) are made of stainless steel or engineering plastics.
The grinding wheel feeding system uses a fully closed-loop position control; both the supporting guide rail and driving screw rod are from the Taiwan HIWIN brand, and the driving motor is from the Xin Jie brand.
The electrical control system employs a PLC + human-machine interface configuration, with the PLC from Mitsubishi (Japan) and the human-machine interface from Weintek.
