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  1. Auto Insertion Machine
  2. SMT Feeder Machine​
  3. SMT Peripheral Equipment
  4. PCBA and PCB Cleaning Machine
  5. PCB Separator Machine
  6. Wire Bonding and Die Bonder
  7. PCB Board Handing System
  8. lon Beam Equipment
  9. ESD Anti-static Product

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Wire Bonder for IC

Die Bonder for Semiconductor

A die bonder is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a printed circuit board. It's the process of fixing the wafer chip on the substrate or package.
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High Speed Wire Bonder HW585 for IC

Description

This HW812 high precision die bonder is a high accuracy system for chip-to-chip and chip-to-wafer bonding, on wafers up to 12″. The tool features automated handling of chips and substrates. The cycle time is up to 250ms.

It is compatible with IC frame.

Features
  • Dual dispensing system utilizing a screw pattern.
  • High precision linear drive solid crystal binding head, voice coil torque ring to accurately control the solid crystal pressure.
  • High-precision search chip platform, servo motor-driven chip angle correction system, equipped with 12″ wafer automatic film expansion system.
  • Adopting dispensing independent control system, more precise control of glue quantity.
  • Vertical dispensing adopts high-precision grating reading head height measurement, Z-axis linear motor drive, before and after the detection of dispensing using the camera vertical detection mode, to improve the accuracy of the detection of the glue point.
  • Independent XYZ axis mechanism.
  • Equip high precision dispensing group.
  • With drawing glue function.
  • With before dispensing, after dispensing detection function.
  • Glue spot size and position automatic compensation function.
  • Vacuum leakage detection.
  • Accurate automation equipment improves production efficiency, reduces cost.
Technical Parameters

Model

HW812

UPH

Max 17K

Accuracy

±20μm

Rotation

±3°

Chip dimension

15×15 – 200x200mil

Max angle correction

±15°

Max wafer size

12″

X/Y resolution

1μm

Thimble Z stroke

3mm

Donder head

Linear motor driven, head rotation

Chip absorbing pressure

30-300g

Fixture length

110-300mm

Fixture width

25-110mm

Power supply

AC220V 50HZ

Air supply

0.5Mpa

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