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Wire Bonder for LED

Wire bonding machine can be used connect an integrated circuit to the other electronics or connect from one printed circuit board to another, it's the most cost-effective and flexible interconnect technology.

High Speed Wire Bonder HW582 for LED Product

This HW582 LED high-speed wire bonder is mainly designed for small BTO end LED products, with a cycle time of 40ms/wire. Applicable to variable wire materials: gold/alloy/copper wire. Taking fine wire bonding to new levels of productivity and efficiency. Fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles.

  • With high UPH, based on the brand-new design high-speed and high rigidity XY platform brings customers fast, precision, and stable experience.
  • Develop fast loop mode for the LED industry, UPH comprehensively improved, supports customers with various complex looping types, easy and fast installation.
  • Equipped with a new high-speed PR algorithm, the recognition efficiency and recognition speed are increased by 30% compared with the last generation.
  • Brand new EFO function design, multi-stage high precision output in EFO stage.
  • Fast, real-time, accurate and high-precision post bond inspection (PBI).
  • Brand new structure design, greatly simplified the maintenance and lower the cost, improves customers on site efficiency.
Wire Bonder for LED

Capability

Cycle time

40ms/wire

Bonding accuracy

±2μm

Wire diameter

Φ15μm-Φ50μm

XY Table

Drive Mechanism

Linear motor driven

XY Resolution

50nm

Bonding area

X:56mm, Y:75mm

PR system

1/3″ CMOS camera

Material Handling system

Handling Mechanism

Vertical stack

No. of magazines

2-3

Applicable magazine

Length

100-275mm

Width

22-78mm

Thickness

0.07-2.0mm
(≥1.0mm can be customized)

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