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The Temporary Bonder Machine is an innovative device designed for precise adhesive bonding in manufacturing processes. It utilizes advanced technology to temporarily bond materials, ensuring alignment and positioning while allowing for easy removal after processing. Ideal for use in electronics, automotive, and aerospace industries, this machine enhances production efficiency and improves product quality by streamlining assembly operations.

The Vertical Thinning Machine is designed for high-speed processing of hard and brittle materials like sapphire and ceramics. Featuring a vertical structure and a wafer self-selection grinding principle, it offers customized product carriers and a fully closed-loop control system for precise grinding. Constructed from high-quality materials, this machine ensures durable performance with excellent accuracy, making it ideal for advanced manufacturing applications.

The Auto Epoxy Die Bonder is a precision equipment designed for automated die bonding in semiconductor packaging. It utilizes advanced epoxy adhesive technology, ensuring strong bond integrity. Features include programmable settings, high-speed operation, and real-time monitoring, enhancing efficiency and reducing the risk of contamination during the bonding process. Ideal for high-volume production environments.

The Automatic Eutectic Mounter is a sophisticated device for precisely attaching semiconductor chips to substrates. It employs advanced eutectic bonding technology, ensuring high reliability and efficiency. Key features include precision placement, user-friendly touch screen controls, versatile bonding methods, high throughput, real-time monitoring, and a compact design for seamless integration into manufacturing lines.

The dual-axis copper polishing machine is a specialized device designed for efficiently polishing copper components. Utilizing a dual-axis motion system, it ensures thorough and uniform surface treatment by allowing multiple angles of approach. This machine is ideal for enhancing the finish of copper items, improving their aesthetic appeal and preparing them for subsequent processes such as plating or coating. Its precision engineering and advanced features make it suitable for both small-scale workshops and large manufacturing operations, ensuring consistent quality and high productivity in copper polishing tasks.

The eutectic die attach machine is a specialized device used in the semiconductor packaging process to precisely bond chips to substrates. Its operation is based on the melting and solidification of eutectic alloys, typically utilizing gold or aluminum eutectic for the adhesion material.

This type of machinery is especially important in the electronic packaging industry, as it provides reliable bonding under high-temperature and high-pressure conditions, ensuring effective thermal and electrical connections between the chip and the substrate. Eutectic die attach machines typically feature precise temperature and pressure control systems, enabling fully automated or semi-automated operations with high repeatability and accuracy, thus improving production efficiency and yield.

A fully automatic dicing machine is an efficient device used for precise cutting of electronic components, widely applied in the processing of materials such as semiconductors, ceramics, and glass. These machines are typically equipped with advanced spindle systems, automatic blade replacement functions, and high-precision positioning systems to ensure cutting quality and production efficiency.

This equipment is mainly used for SIC substrate wafer cutting The splitting process behind the laser processing equipment technology of cutting Art Equipment

This series of equipment is designed specifically for the characteristics of laser cutting silicon substrate wafers, utilizing a UV laser and a specially designed external optical path system, combined with a high-precision CCD imaging positioning system and high-precision platform motion control to achieve precise, efficient cutting results with almost no residues in the cutting groove.

SMT Pick and Place Machine  Home / Product Center China SMT Pick and Place Machine Manufacturer Table of Contents   SMT Pick and Place Machine Hot style

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Automatic SMT Feeder Machine  Home / Product Center China automatic smt feeder machine Table of Contents SMT Feeder Machine Hot style Vibration Bowl Feeder The vibratory bowl

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