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ICバーナーマシン

HW-AU910 device, equipped with four nozzles and optical positioning, is suitable for IC multiple pick-and-place automatic burn-in system. Vacuum suction, lock automatic opening function. At least four burners can be connected simultaneously, with offline burning function flash memory download mode.

Automatic IC burner machine HW- AU910

With IC burning, testing, and a multi-functional feeding system suitable for tray, roll, and tube packages. Optical image automatic position system, control servo moving position accurately and quickly, four-axis high-speed linkage, IC discharge stable and reliable.

A single cycle is about 2-3 seconds, has more effective burn-in quality, the failure rate is less than 1/1000, and the output reaches more than 1000-1500pcs per hour.

  • Support three packages of IC: tube, tray, and tape.
  • After burning, you can change the package method to whatever you want.
  • Equipped with two high CCDs, with accurate positioning.
  • The tray package can realize automatic loading and unloading.
  • It can be customized according to the burner provided by the customer.
  • Equipped with alarm.
  • High-speed servo mobile device, the system includes linear slide rails, screw robs, and high-performance mechanical devices.
  • It can be extended to various input/output burner modules, applicable to all brands of burners.
  • Equipped with component direction recognition.
  • With all kinds of protection and anti-dulling functions.
  • This machine can convert at any time due to different IC in and out packaging methods such as roll, tube, tape, etc.
  • With printer, which provides printing dots and markings before IC packaging.
  • Machine dimension L*W*H(mm): 1380*1100*1550mm
  • Weight: 1500KG
  • Power supply: 220VAC 50HZ
  • 空気供給0.4-0.6Mpa
  • Number of burners: 64 burning stations (can be expanded according to customer needs)
  • Burner modules can be changed for different IC burning.
  • Suitable for PLCC, JLCC, SOIC, QFP, QFN, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, etc.
  • UPH is about 1000-1500, with different ICs with different UPH.

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